Optimization Design of Packaging Insulation for Half-Bridge SiC MOSFET Power Module Based on Multi-Physics Simulation

With the development of power modules for high voltage, temperature, and density, their size is becoming smaller, packaging insulation experiences higher electrical, thermal, mechanical stress. Packaging needs to meet requirement that internal electric field, stress should be as low possible. Focusing on coupling principles optimization design among stresses in module insulation, a multi-objective method based Spice circuit, finite element field numerical calculation, gray wolf optimizer (MOGWO) proposed. The optimal 1.2 kV SiC MOSFET half-bridge presented. First, conductivity characteristics substrate ceramic encapsulation silicone material were tested at different temperatures external strengths, which provided key parameters calculation distribution. Secondly, according mutual electric–thermal–mechanical stress, influence structure distribution was studied by combined with circuit analysis. Finally, MOGWO algorithm used optimize insulation. structural fabricate corresponding module. fabricated compared commercial double-pulse experiment partial discharge verify feasibility proposed method.